At CES 2026, GIGABYTE unveiled its exclusive X3D Turbo Mode 2.0 technology, designed to unlock the full potential of AMD Ryzen 9000 Series Processors with AMD 3D V-Cache technology. This AI-powered solution delivers real-time, adaptive performance tuning that pushes X3D CPUs beyond traditional operational limits through advanced hardware-software integration.
Flagship X870E AORUS XTREME X3D AI TOP Performance
The flagship X870E AORUS XTREME X3D AI TOP motherboard showcases GIGABYTE’s commitment to high-performance computing. The board supports DDR5 speeds up to 9000+ MT/s, providing exceptional memory bandwidth and stability for demanding applications.
GIGABYTE’s advanced thermal architecture includes the CPU Thermal Matrix system, which reduces VRM and DDR temperatures by up to 8.5°C. The DDR Wind Blade XTREME cooling solution further lowers module temperatures by up to 9°C, while the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C for sustained performance.
Expanded Motherboard Lineup with Design Focus
Beyond performance, GIGABYTE introduced design-forward options including the X870E AERO X3D WOOD model, featuring wood-grain textures and leather pull tabs for a natural aesthetic. The company also expanded its PROJECT STEALTH series with sleek black X870 and B850 AORUS STEALTH motherboards.
The PROJECT STEALTH series adopts a reverse-connector layout that provides a clean, cableless visual appearance and simplified assembly experience, giving builders greater flexibility in system design and cable management.
CES 2026 Exhibition Details
Attendees can experience GIGABYTE’s complete product lineup at Booth #8519 in LVCC North Hall during CES 2026. Media and VIP sessions are scheduled at Venetian Ballroom Level 3 in rooms Lido 3004, 3005, and 3104, offering hands-on demonstrations of the X3D Turbo Mode 2.0 technology and new motherboard designs.