AMD AI infrastructure investments now exceed $10 billion across the Taiwan ecosystem, the company announced on May 21. The investment aims to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI systems.
The funds will support collaborations with Taiwan-based firms including ASE, SPIL, PTI, and others. These partnerships focus on developing wafer-based 2.5D bridge interconnect technology, known as EFB, which increases interconnect bandwidth and improves power efficiency. The EFB architecture supports AMD’s 6th Gen EPYC CPUs, codenamed “Venice.”
Investment Details and Ecosystem Partnerships
AMD is working with ASE and SPIL to develop and qualify next-generation EFB technology. Panel-based innovation with PTI has achieved qualification of the industry’s first 2.5D panel-based EFB interconnect. These technologies allow customers to deploy more efficient AI systems while improving overall economics.
“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand,” said Dr. Lisa Su, Chair and CEO, AMD. “By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.”
Dr. Lisa Su, Chair and CEO, AMD
New Packaging Technology for EPYC “Venice” CPUs
The EFB-based 2.5D packaging enables higher interconnect bandwidth and efficiency in 6th Gen AMD EPYC CPUs. This translates into faster, more efficient systems capable of delivering greater performance-per-watt. The technology also supports high-bandwidth memory integration and 3D hybrid bonding techniques that AMD has developed over years of chiplet architecture leadership.
AMD Helios Platform Deployment
AMD and its ecosystem partners are applying these innovations to support deployment of the AMD Helios rack-scale platform in the second half of 2026. The platform combines AMD Instinct MI450X GPUs, 6th Gen AMD EPYC CPUs, advanced networking, and the AMD ROCm open software stack. Leading ODM partners including Sanmina, Wiwynn, Wistron, and Inventec are helping to build Helios-based systems. The platform is designed for multi-gigawatt deployments.
AMD AI Infrastructure Investments Expand to Meet Demand
The announcement underscores how AMD AI infrastructure investments are extending through strategic partnerships that advance silicon, packaging, and manufacturing. “AMD is advancing leading-edge silicon, packaging and manufacturing technologies that enable higher performance, greater efficiency and faster deployment of AI systems,” the company stated. These investments build on AMD’s long-standing partnerships in Taiwan and globally for high-performance computing innovations.
