liquid cooling

LG Electronics has secured official NVIDIA certification for its 600kW coolant distribution unit, validating its thermal management technology for AI infrastructure.

Vertiv has announced plans to double its chiller production capacity at the Tognana campus by 2026 and build a new testing laboratory by 2027.

NVIDIA is using 113-degree Fahrenheit water to cool its modern data center hardware, improving energy efficiency for cloud and AI infrastructure.

Vertiv has opened a new manufacturing facility in Johor, Malaysia, to address the growing demand for AI and high-density computing infrastructure across Asia.

NVIDIA has introduced its new Vera Rubin supercomputing platform, delivering 7 exaflops of AI performance and 5 petaflops of native FP64 power for scientific research.

Vertiv has expanded its thermal management systems in EMEA with the launch of the CoolChip CDU 2300 and Fluid Network Row Manifolds.

The REDMAGIC 11S Pro gaming smartphone has launched globally, featuring the Snapdragon 8 Elite Gen 5 processor and a 7,500mAh battery.

Vertiv announces new configurations of the MegaMod HDX liquid cooling solution, delivering scalable capacity up to 10 MW for high-density AI and HPC deployments. The hybrid cooling system supports rack densities from 50 kW to over 100 kW per rack.

Vertiv’s latest Frontiers report reveals five critical AI data center trends reshaping the industry, including higher voltage DC power architectures, distributed AI infrastructure, energy autonomy, digital twin technology, and adaptive liquid cooling systems driven by extreme densification and gigawatt-scale demands.