Vertiv has expanded its liquid cooling portfolio in Europe, Middle East, and Africa (EMEA) to support high-density compute infrastructure. The company introduced the Vertiv CoolChip CDU 2300 and the Vertiv CoolChip Fluid Network Row Manifolds to address the thermal management demands of artificial intelligence workloads.
These new systems are designed to integrate with existing data center infrastructures. The expansion of this liquid cooling portfolio allows operators to manage heat dissipation from high-density servers more efficiently.
Expansion of the liquid cooling portfolio
The newly introduced components are part of the company’s end-to-end thermal chain. This system includes direct-to-chip cooling, immersion cooling, rear-door heat exchangers, and intelligent controls.
“The rapid growth of AI workloads is driving a fundamental shift in how data centers are designed, cooled, powered and operated,”
Paul Ryan, President for EMEA at Vertiv
Technical Specifications of the CDU 2300
The Vertiv CoolChip CDU 2300 is a liquid-to-liquid coolant distribution unit. It delivers 2.3 MW of cooling capacity within a compact footprint, allowing for flexible installation in-row or in adjacent mechanical areas.
The system supports direct-to-chip liquid cooling and rear-door heat exchangers. It features an integrated controller that adjusts temperature and flow based on real-time workload demands.
Fluid Network Row Manifolds Features
The Vertiv CoolChip Fluid Network Row Manifolds establish the physical connection between coolant distribution units and server-level hardware. Each manifold assembly undergoes flushing, passivation, and pressure testing to prevent leaks and resist corrosion.
This configurable design supports multiple cooling methods, including immersion and direct-to-chip systems. Consequently, operators can deploy or retrofit liquid-cooling infrastructure in weeks instead of months.
Support Services and Industry Context
To assist operators, the company offers Vertiv Liquid Cooling Services. These services cover design support, installation, and ongoing maintenance for data centers.
Integrating these systems into the broader liquid cooling portfolio provides a structured approach to managing high-density thermal challenges. Vertiv is showcasing these technologies at the Datacloud Global Congress in Cannes from June 1 to 4, 2026.
Vertiv operates in more than 130 countries, providing hardware, software, and analytics for critical digital infrastructure. The company is headquartered in Westerville, Ohio, USA, and is listed on the New York Stock Exchange, contributing to the global digital economy.
